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Rogers-TMM3-High Frequency-Printed-Circuit-Board-15mil-30mil-60mil-DK3.27-RF-PCB-With- Low-Loss |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers TMM3 high - frequency PCBs are composite materials made from a combination of ceramic, hydrocarbon, and thermoset polymers. These laminates are specifically engineered for stripline and microstrip applications that demand high reliability of plated - through holes (PTH). TMM3 laminate features a dielectric constant of 3.27 and a dissipation factor of 0.002, which contribute to its excellent electrical performance.
One of the outstanding characteristics of TMM3 PCB is its extremely low thermal coefficient of dielectric constant. Its isotropic thermal expansion coefficients are closely aligned with those of copper. This close match enables the fabrication of highly reliable plated - through holes and results in minimal etch shrinkage. Additionally, TMM3 substrate has a thermal conductivity that is roughly double that of conventional PTFE/ceramic laminates, which significantly enhances heat dissipation capabilities.
Rogers TMM3 PCB is based on thermoset resins, which means it does not soften upon heating. This property allows for wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation, ensuring the integrity and reliability of the circuit assembly process. |
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Typical Applications |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our PCB Capability(TMM3) |
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PCB Capability (TMM3) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM3 |
Dielectric constant: |
3.27 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.. |
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Why Choose Us? |
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1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3 |
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Typical Value of TMM3 |
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TMM3 Typical Value |
Property |
TMM3 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.27±0.032 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
3.45 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
+37 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 109 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
>9x 10^9 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
441 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
15 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
15 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
23 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
16.53 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.72 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.12 |
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Specific Gravity |
1.78 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.87 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
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- |
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- |
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Hot Tags:
Rogers TMM PCB |
TMM3 15mil 30mil 60mil PCB |
Rogers TMM3 Immersion Gold PCB |
TMM3 High Frequency PCB |
DK3.27 RF PCB |
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